IEC 60068-3-4 Ed. 1.0 b:2001 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests standard by International Electrotechnical Commission, 08/28/2001
IEC 61000-3-2 Amd.1 Ed. 2.0 b:2001 [ Withdrawn ] Amendment 1 - Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current <= 16 A per phase) Amendment by International Electrotechnical Commission, 08/28/2001
IEC 60191-2 Amd.3 Ed. 1.0 b:2001 Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions Amendment by International Electrotechnical Commission, 08/28/2001
IEC 60627 Ed. 2.0 b:2001 [ Withdrawn ] Diagnostic X-ray imaging equipment - Characteristics of general purpose and mammographic anti-scatter grids standard by International Electrotechnical Commission, 08/28/2001
IEC 60191-2 Amd.3 Ed. 1.0 en:2001 Amendment 3 Amendment by International Electrotechnical Commission, 08/28/2001
IEC 60068-3-5 Ed. 1.0 b:2001 [ Withdrawn ] Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers standard by International Electrotechnical Commission, 08/27/2001
IEC 60287-1-1 Amd.2 Ed. 1.0 b:2001 [ Withdrawn ] Amendment 2 - Electric cables - Calculation of the current rating - Part 1: Current rating equations (100% load factor) and calculation of losses - Section 1: General Amendment by International Electrotechnical Commission, 08/27/2001
IEC 60191-6-8 Ed. 1.0 en:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) standard by International Electrotechnical...
IEC 60191-6-5 Ed. 1.0 en:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) standard by International Electrotechnical Commission,...
IEC 60191-6-8 Ed. 1.0 b:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) standard by International Electrotechnical...
IEC 60793-1-33 Ed. 1.0 b:2001 [ Withdrawn ] Optical fibres - Part 1-33: Measurement methods and test procedures - Stress corrosion susceptibility standard by International Electrotechnical Commission, 08/27/2001
IEC 60068-3-7 Ed. 1.0 b:2001 [ Withdrawn ] Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load) standard by International Electrotechnical Commission, 08/27/2001