IEC 62571 Ed. 1.0 en:2011 Digital audiobook file format and player requirements standard by International Electrotechnical Commission, 03/29/2011
IEC 61300-1 Ed. 3.0 b:2011 [ Withdrawn ] Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 1: General and guidance standard by International Electrotechnical Commission, 03/23/2011
IEC 60364-7-718 Ed. 1.0 b:2011 Low-voltage electrical installations - Part 7-718: Requirements for special installations or locations - Communal facilities and workplaces standard by International Electrotechnical Commission, 03/23/2011
IEC 62359 Ed. 2.0 b CORR1:2011 Corrigendum 1 - Ultrasonics - Field characterization - Test methods for the determination of thermal and mechanical indices related to medical diagnostic ultrasonic fields Corrigenda by International Electrotechnical Commission, 03/15/2011
IEC 60838-1 Amd.2 Ed. 4.0 b:2011 [ Withdrawn ] Amendment 2 - Miscellaneous lampholders - Part 1: General requirements and tests Amendment by International Electrotechnical Commission, 03/14/2011
IEC 60512-26-100 Amd.1 Ed. 1.0 b:2011 Amendment 1 - Connectors for electronic equipment - Tests and measurements - Part 26-100: Measurement setup, test and reference arrangements and measurements for connectors according to IEC 60603-7 - Tests 26a to 26g Amendment by International Electrotechnical...
IEC 60793-2-10 Ed. 4.0 b:2011 [ Withdrawn ] Optical fibres - Part 2-10: Product specifications - Sectional specification for category A1 multimode fibres standard by International Electrotechnical Commission, 03/14/2011
IEC 60745-2-22 Ed. 1.0 b:2011 Hand-held motor-operated electric tools - Safety - Part 2-22: Particular requirements for cut-off machines standard by International Electrotechnical Commission, 03/14/2011
IEC 60679-6 Ed. 1.0 b:2011 [ Withdrawn ] Quartz crystal controlled oscillators of assessed quality - Part 6: Phase jitter measurement method for quartz crystal oscillators and SAW oscillators - Application guidelines standard by International Electrotechnical Commission, 03/14/2011
IEC 60191-5 Ed. 2.0 b:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) standard by International Electrotechnical Commission, 04/23/1997
IEC 60748-4 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits standard by International Electrotechnical Commission, 04/23/1997
IEC 61319-2 Ed. 1.0 b:1997 Interconnections of satellite receiving equipment - Part 2: Japan standard by International Electrotechnical Commission, 04/23/1997