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GMW16552
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GMW16552 2nd Edition, January 1, 2018 Semiconductor Change Process Specification
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Description / Abstract:
Introduction
Note: Nothing in this standard supercedes applicable laws and regulations.
Note: In the event of conflict between the English and domestic language, the English language shall take precedence.
Purpose. This standard defines the GM Supplier Hardware Change Management Process for Semiconductor Part Changes. This process is the means by which the Electrical Component/Subsystem Supplier shall propose changes directly to GM, or to GM and GMʹs Integration Supplier when there is an Integration Supplier, due to Unexpected Part Shortages, part ʺend of lifeʺ, part modifications, etc. This process does not apply to changes, made due to a change request from GM, that affect functions or features, changes to correct non-compliances, etc. The Electrical Component/Subsystem Supplier is defined as a supplier who receives electrical requirements from GM.
The Supplier Hardware Change Management Process for Semiconductor Part Changes is to be used as a method for communicating the technical viability of a change proposal for any electrical component/subsystem. Any approval authority stated herein shall apply only to the technical element of the proposed change. This process does not replace the Engineering Work Order (EWO) or any other GM cost and investment process where the supplier receives authorization to change piece price, investment, etc. Also, this process does not replace any Production Part Approval Process (PPAP) or supplier quality requirements and processes.
Applicability.
This specification describes the process a supplier shall use to request approval for a semiconductor part change that may occur during normal production. This process includes the following:
a. Information that shall be included with the request, including supplier tasks to be completed prior to submitting the request.
b. Timing of information submittal, approval, completion of testing, and change in parts of delivered GM components.
c. Types of Semiconductor changes and the typical testing required based on the change including electrical behavior, environmental testing and Electromagnetic Compatibility (EMC) testing.
Remarks. Within this document the following conventions are applied:
The word "Shallʺ shall be used in the following ways:
a. To state a binding requirement, which is verifiable by external manipulation and/or observation.
b. To state a binding requirement upon a requirementʹs document that is verifiable through a review of the document.
The word ʺMustʺ shall be used to state a binding requirement which will have a corresponding Electronic Control Unit (ECU) document or Component Requirements Document. These requirements will be verified as part of the component verification.
The word ʺShouldʺ denotes a preference or desired conformance.
Note: Nothing in this standard supercedes applicable laws and regulations.
Note: In the event of conflict between the English and domestic language, the English language shall take precedence.
Purpose. This standard defines the GM Supplier Hardware Change Management Process for Semiconductor Part Changes. This process is the means by which the Electrical Component/Subsystem Supplier shall propose changes directly to GM, or to GM and GMʹs Integration Supplier when there is an Integration Supplier, due to Unexpected Part Shortages, part ʺend of lifeʺ, part modifications, etc. This process does not apply to changes, made due to a change request from GM, that affect functions or features, changes to correct non-compliances, etc. The Electrical Component/Subsystem Supplier is defined as a supplier who receives electrical requirements from GM.
The Supplier Hardware Change Management Process for Semiconductor Part Changes is to be used as a method for communicating the technical viability of a change proposal for any electrical component/subsystem. Any approval authority stated herein shall apply only to the technical element of the proposed change. This process does not replace the Engineering Work Order (EWO) or any other GM cost and investment process where the supplier receives authorization to change piece price, investment, etc. Also, this process does not replace any Production Part Approval Process (PPAP) or supplier quality requirements and processes.
Applicability.
This specification describes the process a supplier shall use to request approval for a semiconductor part change that may occur during normal production. This process includes the following:
a. Information that shall be included with the request, including supplier tasks to be completed prior to submitting the request.
b. Timing of information submittal, approval, completion of testing, and change in parts of delivered GM components.
c. Types of Semiconductor changes and the typical testing required based on the change including electrical behavior, environmental testing and Electromagnetic Compatibility (EMC) testing.
Remarks. Within this document the following conventions are applied:
The word "Shallʺ shall be used in the following ways:
a. To state a binding requirement, which is verifiable by external manipulation and/or observation.
b. To state a binding requirement upon a requirementʹs document that is verifiable through a review of the document.
The word ʺMustʺ shall be used to state a binding requirement which will have a corresponding Electronic Control Unit (ECU) document or Component Requirements Document. These requirements will be verified as part of the component verification.
The word ʺShouldʺ denotes a preference or desired conformance.