Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
Reduced price!
View larger
View larger
IEC 61188-5-3 Ed. 1.0 b:2007
M00001684
New product
IEC 61188-5-3 Ed. 1.0 b:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
standard by International Electrotechnical Commission, 10/30/2007
In stock
More info
Full Description
IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.This publication is to be read in conjunction with IEC 61188-5-1 :2002.