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IEC 61188-5-3 Ed. 1.0 en:2007

M00001688

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IEC 61188-5-3 Ed. 1.0 en:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

standard by International Electrotechnical Commission, 10/30/2007

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Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

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Edition: 1.0 Published: 10/30/2007 Number of Pages: 29 File Size: 1 file , 950 KB