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IEC 60191-6-1 Ed. 1.0 en:2001

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IEC 60191-6-1 Ed. 1.0 en:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

standard by International Electrotechnical Commission, 10/30/2001

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Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

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Edition: 1.0 Published: 10/30/2001 Number of Pages: 7 File Size: 1 file , 230 KB