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IEC 60191-6-5 Ed. 1.0 en:2001

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IEC 60191-6-5 Ed. 1.0 en:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

standard by International Electrotechnical Commission, 08/27/2001

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Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

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Edition: 1.0 Published: 08/27/2001 Number of Pages: 10 File Size: 1 file , 330 KB